説明はありません
エッジコンピューティング向けチップとソフトウェアのスタートアップ企業であるSiMa.aiは、新たな製品であるMLSoC Modalixチップを発表し、エッジAI市場における地位をさらに強化しました。SiMa.aiは最近、Dell Technologies Capitalなどの業界大手から7000万ドルの資金調達を完了しました。
SiMa.aiは多くの分野で物理AI技術を拡張することができます。
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