小米は初の大規模モデル専用AIアクセラレーターチップ「玄戒O100」を発表。6nmプロセスと3Dウェハレベル積層を採用し、帯域幅と集積度を向上。コア演算チップの自社開発で重要な一歩を示し、端末メーカー間のAIハードウェア競争が本格段階に入ったことを示す。....
小米が初の端末側大規模モデルAI加速チップ「玄戒O100」を発表。6nmウェハ垂直積層とハイブリッドボンディング、ピッチ1.4μm、帯域1.22TB/s、従来比16倍、推論330TPS、端末側大規模モデルのスループットと推論能力を強化。....
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