As the competition in the artificial intelligence field intensifies, a company that was established only one year ago is attracting industry attention with its astonishing growth rate. On June 18th, China's leading world model company Manifold AI officially announced a new round of financing worth hundreds of millions of yuan.

This round of financing not only received support from institutions such as Guoxin Fund, Yifeng Capital, BAIC Industrial Investment, and Xinneng Venture Capital, but the four previous shareholders also chose to invest additional capital. Behind this impressive data is the company's achievement of completing six rounds of financing within just one year since its establishment, with the Pre-A round raising nearly 1 billion yuan. This has rapidly positioned it among the world model unicorns and proved the market's high recognition of its technical approach.

Investment, Financing, Money

As the first domestic company to take its self-developed world model as the foundation of embodied intelligence, Manifold AI has a clear technological development roadmap. Its core product, the real-time world model "WorldScape," has performed well in multiple industry evaluations, fully demonstrating the model's deep understanding and simulation capabilities of complex physical worlds. Currently, related products based on this model have been successfully applied in multiple practical scenarios, verifying the possibility of transitioning from the laboratory to commercial applications.

Regarding the use of this round of financing, the company stated that it will mainly be invested in subsequent technology iterations, computing platform construction, and deeper exploration of scenario applications. As embodied intelligence becomes the next breakthrough point in the AI field, Manifold AI is trying to establish a solid competitive moat in this cutting-edge area through capital support and technological accumulation, providing core driving force for the intelligent interaction between robots and the physical world.