Houmo Intelligence Completes Several-Billion-Yuan Series B Financing; On-Device Large-Model AI Chips Enter Fast Lane to Large-Scale Deployment

On November 4, Houmo Intelligence, a leading Chinese company in compute-in-memory AI chips, announced that it had recently completed a Series B financing round totaling several billion yuan. This is also one of several major financing rounds it has completed consecutively within a year. This round attracted collective bets from upstream and downstream industry capital, with state-owned capital, international investors, and several existing shareholders jointly joining or continuing to increase their investments. This capital lineup demonstrates the recognition of its development prospects by domestic and international capital.