英伟达在GTC2026大会上发布下一代AI加速平台“Vera Rubin”，以天文学家薇拉·鲁宾命名，标志着公司向全栈AI工厂基础设施转型。该平台采用台积电3纳米制程，集成3360亿晶体管，性能较前代提升超60%。其“六芯协同”架构重塑超算标准，超级芯片整合Vera CPU与双Rubin GPU。
英伟达CEO黄仁勋在GTC大会上预测，到2027年底，其新一代Blackwell和Rubin架构芯片将累计创造至少1万亿美元收入，较此前2026年底5000亿美元的预期大幅提升，凸显了公司在AI算力爆发背景下的强劲增长势头。
英伟达向云服务商CoreWeave追加20亿美元投资，以每股87.20美元购买其A类股票。双方将合作建设“AI工厂”，目标到2030年新增超5吉瓦AI算力。新数据中心将全面集成英伟达最新技术栈，包括采用下一代Rubin架构芯片替代现有Blackwell架构。
在2026年CES展上，英伟达发布下一代AI平台“鲁宾”，核心为全新超级芯片Vera Rubin。该平台旨在为智能体AI和大规模推理模型提供更强算力，芯片采用创新集成设计，提升高性能计算效率。
Baidu
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