SK 海力士预计 AI 内存市场年增长 30% 至 2030 年
SK海力士高管预测，AI专用高带宽内存(HBM)市场将以年增30%的速度持续增长至2030年。HBM通过垂直堆叠芯片技术提升能效，已成为处理AI大数据的核心组件。公司正与三星、美光竞逐下一代HBM4研发，该产品将集成定制化逻辑芯片以增强客户黏性。尽管三星警告HBM3E可能出现供过于求，但云计算巨头持续加码AI投资仍将推动需求。当前NVIDIA等大客户已获得定制服务，未来中小客户对差异化性能的需求也将增长。美国潜在半导体关税政策暂未影响韩国厂商的在美生产计划。（140字）
%20--%3e%3cdefs%3e%3cstyle%3e%20.st0%20{%20fill:%20%23061b40;%20}%20.st1%20{%20fill:%20%23306af1;%20}%20.st2%20{%20fill:%20%235ce5cf;%20}%20%3c/style%3e%3c/defs%3e%3cg%3e%3cpath%20class='st0'%20d='M55,10.5h9v3h-9v9h12V7.5h-12v3ZM64,19.5h-6v-3h6v3Z'/%3e%3cpolygon%20class='st0'%20points='69%2016.5%2078%2016.5%2078%2019.5%2069%2019.5%2069%2022.5%2081%2022.5%2081%2013.5%2072%2013.5%2072%2010.5%2081%2010.5%2081%207.5%2069%207.5%2069%2016.5'/%3e%3cpolygon%20class='st0'%20points='95%2010.5%2095%207.5%2083%207.5%2083%2022.5%2095%2022.5%2095%2019.5%2086%2019.5%2086%2016.5%2095%2016.5%2095%2013.5%2086%2013.5%2086%2010.5%2095%2010.5'/%3e%3cpath%20class='st0'%20d='M40,1.5v21h11.6l1.4-1.4v-7.6h0c0,0-1.4-1.5-1.4-1.5l1.4-1.4V2.9l-1.4-1.4h-11.6ZM50,19.5h-7v-6h7v6ZM50,10.5h-7v-6h7v6Z'/%3e%3c/g%3e%3cpath%20class='st1'%20d='M23.1,24L14.7,4.8l-4.9,11.2h3.8l-1.8,4H3.3L12.1,0H2C.9,0,0,.9,0,2v20c0,1.1.9,2,2,2h21.1Z'/%3e%3cpath%20class='st2'%20d='M34,0h-16.8l10.6,24h6.2c1.1,0,2-.9,2-2V2C36,.9,35.1,0,34,0ZM32.5,20h-4V4h4v16Z'/%3e%3c/svg%3e)
