三星与博通达成长期深度合作，覆盖内存芯片、代工及先进封装全链条，预计到2030年合作规模突破2000亿美元，标志AI芯片进入“设计+制造”深度耦合阶段。技术核心是博通ASIC定制设计能力结合三星制造，双方将在2纳米以下制程与HBM高带宽内存领域联合攻坚。
三星电子会长李在镕与OpenAI CEO山姆·奥特曼在旧金山会面。双方未公布议题，但业内推测围绕扩大AI基础设施合作展开，可能涉及高带宽内存、动态随机存取存储器及先进晶圆代工制造等领域。
三星代工赢得AI新锐Anthropic的芯片制造合同，为陷入低迷的代工业务注入强心针，有望扭转其财务困境。Anthropic倚赖先进AI模型迅速崛起为关键力量。当前AI半导体市场加速集中，英伟达、谷歌、OpenAI和亚马逊等巨头纷纷加紧自研专属芯片，竞争日趋白热化。
全球芯片产能紧张背景下，谷歌计划与三星合作生产新一代AI专用芯片“冰鱼”（第十代TPU），用于云数据中心。该芯片采用分工模式：核心计算引擎由台积电以1.4纳米制程制造，内存输入输出裸片则交由三星负责。此举旨在缓解对台积电的依赖。
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