三星与博通达成长期深度合作，覆盖内存芯片、代工及先进封装全链条，预计到2030年合作规模突破2000亿美元，标志AI芯片进入“设计+制造”深度耦合阶段。技术核心是博通ASIC定制设计能力结合三星制造，双方将在2纳米以下制程与HBM高带宽内存领域联合攻坚。
英伟达与安靠达成约15亿美元多年协议，由英伟达预付支持安靠在亚利桑那州扩建先进封装产能，共同研发面向AI及数据中心加速计算的高密度互连与异构集成等封测技术，以实现不同工艺芯片与组件的高效整合。
三星电子因AI芯片需求暴增导致产能告急，计划在韩国光州建设先进半导体封装工厂以扩张产能。同时，公司还公布了多元投资布局，包括在龟尾推进机器人产业等。
全球AI浪潮推动大模型算力需求激增，金属锡因在半导体先进封装中不可或缺，价格半年内从每吨30万元飙升至42万元，涨幅达40%。算力越强，芯片堆叠越密集，锡的供需失衡成为关键。
Baidu
$1
Input tokens/M
$4
Output tokens/M
64
Context Length
Sensetime
$3
$9
128
Minimax
-
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