随着AI数据中心需求激增，提供关键组件的企业日益重要。成立17年的Phononic公司专注于开发半导体冷却解决方案，防止数据中心过热，确保AI服务器高效运行。
日本半导体企业Rapidus在北海道千岁市启用新型封装试产线，采用600mm×600mm玻璃基板技术，使单板中介层产量提升至十倍，旨在大幅提高AI芯片生产效率。
戴尔CEO警告，全球AI加速器内存需求正爆发式增长，预计2028年将比2023年激增625倍。这一“跃迁式”增长主要由单机容量和部署规模共同推动，给半导体供应链带来巨大压力，供需失衡短期内难以缓解。
Mistral AI CEO访韩会晤三星高层，双方探讨AI芯片供应链与技术合作，欧洲AI企业寻求稳定芯片供应以满足算力需求。
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