美国商务部豪掷 4 亿美元用于推动芯片生产
美国商务部宣布投资4亿美元支持半导体晶圆生产，旨在推动美国科技创新，强化供应链和增加就业。投资是《芯片与科学法案》的一部分，主要授予GlobalWafers公司用于在德克萨斯州谢尔曼和密苏里州圣彼得斯建设新的晶圆制造设施。完成项目预计增加1700个建筑工作岗位和880个制造工作岗位。GlobalWafers将利用这笔资金在德克萨斯生产先进芯片用的300毫米硅晶圆，以及在密苏里州生产耐恶劣环境的芯片。商务部已经与多家知名芯片企业达成合作，投资总额已达301亿美元。探索投资将强化美国在全球经济的竞争实力，促进清洁能源转型。本周商务部还宣布了一项规模高达16亿美元的计划，用于建立和加速国内半导体先进封装的产能。投资旨在吸引芯片供应商并在美国扩大业务，同时促进先进研究和开发，确保美国在全球半导体市场的竞争力。
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