特斯拉下一代AI5芯片已完成流片，预计2027年量产，将接替AI4成为自动驾驶和人形机器人的核心算力平台。其单芯片性能媲美英伟达Hopper架构，双芯配置表现更优。
英伟达在GTC2026大会上发布下一代AI加速平台“Vera Rubin”，以天文学家薇拉·鲁宾命名，标志着公司向全栈AI工厂基础设施转型。该平台采用台积电3纳米制程，集成3360亿晶体管，性能较前代提升超60%。其“六芯协同”架构重塑超算标准，超级芯片整合Vera CPU与双Rubin GPU。
Arduino发布新款单板计算机VENTUNO Q，纪念基金会成立21周年。该产品采用双芯架构，搭载高通Dragonwing平台，主打边缘AI与机器人开发，强调大算力与生成式AI能力，标志着嵌入式开发进入新阶段。
英伟达向云服务商CoreWeave追加20亿美元投资，以每股87.20美元购买其A类股票。双方将合作建设“AI工厂”，目标到2030年新增超5吉瓦AI算力。新数据中心将全面集成英伟达最新技术栈，包括采用下一代Rubin架构芯片替代现有Blackwell架构。
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