日本半导体企业Rapidus在北海道千岁市启用新型封装试产线，采用600mm×600mm玻璃基板技术，使单板中介层产量提升至十倍，旨在大幅提高AI芯片生产效率。
英伟达在GTC2026大会上发布下一代AI加速平台“Vera Rubin”，以天文学家薇拉·鲁宾命名，标志着公司向全栈AI工厂基础设施转型。该平台采用台积电3纳米制程，集成3360亿晶体管，性能较前代提升超60%。其“六芯协同”架构重塑超算标准，超级芯片整合Vera CPU与双Rubin GPU。
微软推出第二代自研AI芯片Maia200，旨在提升Azure云服务AI推理效率，减少对英伟达GPU的依赖。该芯片由台积电代工，已开始向爱荷华州数据中心发货，后续将部署至凤凰城地区。微软高管称其为公司“最高效的推理系统”，将优先供内部超级AI团队使用。
特斯拉与三星签署价值164亿美元的AI芯片代工协议，用于生产下一代AI6芯片。马斯克确认此合作，并透露AI5芯片已接近流片，显示特斯拉在AI硬件领域的战略布局。
Openai
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Baidu
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