惠普发布全新移动工作站ZBook Ultra G3a16，主打端侧AI算力。其搭载AMD锐龙AI Max PRO400“Gorgon Halo”处理器，最高支持192GB统一内存，并可将其中160GB分配为独立显存，面向专业极客与高端开发者，强化本地大模型运行能力。
AMD锐龙AI Max沙龙透露，超20款基于锐龙AI Max+ PRO495平台的设备将上市，多数为迷你主机；惠普例外，将推基于“Gorgon Halo”的ZBook Ultra移动工作站。已知机型包括铭凡N5MAX-P495、MS-S1MAX-P495、极摩客EVO-X5Pro和联想ThinkCentre X Ultra。
三星电子正加速布局AI PC芯片，其自研加速处理器代号“GAIA”计划2027年量产。该芯片由系统LSI事业部主导，基于4nm工艺，核心围绕NPU设计，专注生成式AI任务加速。原型已送测联想、惠普等厂商，进入性能验证阶段。
三星推出代号“GAIA”的生成式AI加速芯片，以专用NPU切入AI PC市场。该芯片采用4纳米工艺和“存储中心型”架构设计，已向联想、惠普等厂商提供原型验证，目标2027年量产，是三星移动NPU技术向PC场景的延伸。
%20--%3e%3cdefs%3e%3cstyle%3e%20.st0%20{%20fill:%20%23061b40;%20}%20.st1%20{%20fill:%20%23306af1;%20}%20.st2%20{%20fill:%20%235ce5cf;%20}%20%3c/style%3e%3c/defs%3e%3cg%3e%3cpath%20class='st0'%20d='M55,10.5h9v3h-9v9h12V7.5h-12v3ZM64,19.5h-6v-3h6v3Z'/%3e%3cpolygon%20class='st0'%20points='69%2016.5%2078%2016.5%2078%2019.5%2069%2019.5%2069%2022.5%2081%2022.5%2081%2013.5%2072%2013.5%2072%2010.5%2081%2010.5%2081%207.5%2069%207.5%2069%2016.5'/%3e%3cpolygon%20class='st0'%20points='95%2010.5%2095%207.5%2083%207.5%2083%2022.5%2095%2022.5%2095%2019.5%2086%2019.5%2086%2016.5%2095%2016.5%2095%2013.5%2086%2013.5%2086%2010.5%2095%2010.5'/%3e%3cpath%20class='st0'%20d='M40,1.5v21h11.6l1.4-1.4v-7.6h0c0,0-1.4-1.5-1.4-1.5l1.4-1.4V2.9l-1.4-1.4h-11.6ZM50,19.5h-7v-6h7v6ZM50,10.5h-7v-6h7v6Z'/%3e%3c/g%3e%3cpath%20class='st1'%20d='M23.1,24L14.7,4.8l-4.9,11.2h3.8l-1.8,4H3.3L12.1,0H2C.9,0,0,.9,0,2v20c0,1.1.9,2,2,2h21.1Z'/%3e%3cpath%20class='st2'%20d='M34,0h-16.8l10.6,24h6.2c1.1,0,2-.9,2-2V2C36,.9,35.1,0,34,0ZM32.5,20h-4V4h4v16Z'/%3e%3c/svg%3e)
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