OpenAI正与联发科、高通及立讯精密合作，研发一款颠覆性智能手机。芯片由OpenAI与联发科、高通联合设计，立讯精密负责制造，标志着AI巨头向硬件领域深度进军。
OpenAI计划联合高通、联发科开发专用手机芯片，并由立讯精密独家制造，预计2028年量产。此举旨在通过软硬件垂直整合，重新定义移动终端交互范式，颠覆现有AI手机体验。
立讯精密启动10亿至20亿元股票回购，价格不超86.96元/股，预计回购1149.95万至2299.91万股。此举响应实控人王来春提议，彰显管理层对公司长期价值的信心。回购股份将用于股权激励或员工持股，以绑定核心团队。公司业绩与市值增长为回购提供支撑。
立讯精密澄清与OpenAI代工传闻不实，强调公司业务正常推进，专注高端消费电子与智能终端制造，拥有垂直整合能力及量产经验。
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