阿里平头哥发布高端AI芯片“真武810E”，性能超越英伟达A800及主流国产GPU，与H20相当。该芯片采用自研架构和互联技术，标志着阿里AI战略“通云哥”正式成型。
2026年1月29日，阿里巴巴旗下平头哥半导体正式发布高端AI芯片“真武810E”，实现了从硬件架构到配套软件的全链路自主研发，标志着阿里AI“黄金三角”战略全面落地。该芯片已在阿里云内部实现万卡规模应用验证。
AI芯片设计初创公司Ricursive Intelligence完成3亿美元融资，估值达40亿美元。公司由前谷歌研究员创立，核心技术是利用AI自动设计AI芯片，其AlphaChip强化学习方法已应用于谷歌芯片设计。本轮融资由Lightspeed领投，英伟达风投等跟投。
微软推出第二代自研AI芯片Maia200，旨在提升Azure云服务AI推理效率，减少对英伟达GPU的依赖。该芯片由台积电代工，已开始向爱荷华州数据中心发货，后续将部署至凤凰城地区。微软高管称其为公司“最高效的推理系统”，将优先供内部超级AI团队使用。
Meta自研的下一代AI训练和推理加速芯片
Anthropic
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