西门子与英伟达合作，在AI芯片验证领域取得突破。通过软硬件深度协同，将传统耗时的芯片前硅设计验证效率实现指数级提升，完成数万亿次循环验证，为下一代AI算力集群快速落地奠定基础。
西门子收购法国半导体测量软件公司Canopus AI，以加强其在半导体行业的技术布局。该交易于2026年1月12日完成，Canopus AI专注于运用人工智能技术提升晶圆和掩膜的检测效率与精度，助力西门子扩展软件领域实力。
西门子已秘密完成对法国AI初创公司Canopus AI的收购，交易金额约1.5亿至3亿欧元。此举旨在为旗下Calibre晶圆制造软件引入前沿计算量测技术，强化AI能力，提升半导体制造竞争力。
西门子与英伟达在CES 2026上联合发布全球首个“工业AI操作系统”。该系统深度融合软硬件，旨在将AI从生产流程的辅助工具，转变为从产品设计源头驱动全产业链变革的核心引擎，强调“重构而非修补”现有工业体系。
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