阿里平頭哥發佈高端AI芯片“真武810E”，性能超越英偉達A800及主流國產GPU，與H20相當。該芯片採用自研架構和互聯技術，標誌着阿里AI戰略“通雲哥”正式成型。
2026年1月29日，阿里巴巴旗下平頭哥半導體正式發佈高端AI芯片“真武810E”，實現了從硬件架構到配套軟件的全鏈路自主研發，標誌着阿里AI“黃金三角”戰略全面落地。該芯片已在阿里雲內部實現萬卡規模應用驗證。
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