阿里平頭哥發佈高端AI芯片“真武810E”，性能超越英偉達A800及主流國產GPU，與H20相當。該芯片採用自研架構和互聯技術，標誌着阿里AI戰略“通雲哥”正式成型。
2026年1月29日，阿里巴巴旗下平頭哥半導體正式發佈高端AI芯片“真武810E”，實現了從硬件架構到配套軟件的全鏈路自主研發，標誌着阿里AI“黃金三角”戰略全面落地。該芯片已在阿里雲內部實現萬卡規模應用驗證。
AI芯片設計初創公司Ricursive Intelligence完成3億美元融資，估值達40億美元。公司由前谷歌研究員創立，核心技術是利用AI自動設計AI芯片，其AlphaChip強化學習方法已應用於谷歌芯片設計。本輪融資由Lightspeed領投，英偉達風投等跟投。
微軟推出第二代自研AI芯片Maia200，旨在提升Azure雲服務AI推理效率，減少對英偉達GPU的依賴。該芯片由臺積電代工，已開始向愛荷華州數據中心發貨，後續將部署至鳳凰城地區。微軟高管稱其爲公司“最高效的推理系統”，將優先供內部超級AI團隊使用。
Meta自研的下一代AI訓練和推理加速芯片
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