深度求索發佈DeepSeek V4.1 Flash，爲全新結構系列最小模型，具備原生多模態視覺理解。新結構旨在提升能力上限、推理速度與吞吐，並可擴展至更大參數。該模型爲552B參數MoE，採用Causal-Encoder-Decoder不對稱結構：輸入激活僅8B，輸出激活16B，HBM需求降至1/4，顯著降低成本。
三星電子2026年Q2財報：在AI熱潮下存儲芯片量價齊升，營收171.5萬億韓元（同比+130%），營業利潤89.5萬億韓元（同比+1813.8%），雙創新高。半導體貢獻超99%利潤，HBM成絕對引擎，已連續三季破紀錄。
三星與博通達成長期深度合作，覆蓋內存芯片、代工及先進封裝全鏈條，預計到2030年合作規模突破2000億美元，標誌AI芯片進入“設計+製造”深度耦合階段。技術核心是博通ASIC定製設計能力結合三星製造，雙方將在2納米以下製程與HBM高帶寬內存領域聯合攻堅。
OpenAI已部署AMD Helios GPU機架，併合作開發下一代MI500系列AI芯片。該芯片預計2027年推出，採用臺積電2nm製程、CDNA6架構與HBM4E內存，計劃實現四年千倍性能躍升，內存帶寬再創新高。
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