OpenAI已部署AMD Helios GPU機架，併合作開發下一代MI500系列AI芯片。該芯片預計2027年推出，採用臺積電2nm製程、CDNA6架構與HBM4E內存，計劃實現四年千倍性能躍升，內存帶寬再創新高。
OpenAI爲擺脫對英偉達依賴，正加速自研AI處理器，並與三星電子達成關鍵合作。三星將爲其供應下一代高帶寬內存HBM4芯片，用於OpenAI首款自研AI芯片。這標誌着OpenAI從軟件向硬件領域的重要跨越，其“星門項目”背後的算力野心進一步顯現。
OpenAI首席戰略官Jason Kwon表示，韓國具備AI創新理想條件，將與SK海力士和三星電子合作加速發展。他指出，這兩家公司在存儲市場的領先地位爲AI計算提供強有力支撐，特別是SK海力士的高帶寬存儲器（HBM）技術在AI和數據中心中發揮關鍵作用。
英特爾近日首次曝光新一代AI芯片Jaguar Shores，目前正由熱工程團隊測試冷卻方案。該芯片採用92.5mm×92.5mm封裝，專爲高性能計算平臺設計，是英特爾首款機架級解決方案。採用18A先進工藝，配備HBM4內存，爲多領域多IP產品。
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