AMD CEO蘇姿豐預計下月親赴韓國，與三星電子高層會談，重點討論AI芯片與技術合作，最受關注的是三星有望成爲AMD的HBM4供應商。雙方今年3月已簽署AI存儲芯片與計算技術合作諒解備忘錄，當時便有傳聞稱三星被AMD選爲AI芯片合作方，此次會談或推動合作落地。
韓國AI芯片創企FuriosaAI公佈第三代AI推理加速器：與博通合作，含2顆2nm計算裸晶、1顆I/O裸晶、12個48GB HBM4(E)堆棧，支持PCIe Gen7，機架內SUE全連接。尺寸爲二代8倍，算力32 PFLOPS爲二代32倍。
OpenAI已部署AMD Helios GPU機架，併合作開發下一代MI500系列AI芯片。該芯片預計2027年推出，採用臺積電2nm製程、CDNA6架構與HBM4E內存，計劃實現四年千倍性能躍升，內存帶寬再創新高。
OpenAI爲擺脫對英偉達依賴，正加速自研AI處理器，並與三星電子達成關鍵合作。三星將爲其供應下一代高帶寬內存HBM4芯片，用於OpenAI首款自研AI芯片。這標誌着OpenAI從軟件向硬件領域的重要跨越，其“星門項目”背後的算力野心進一步顯現。
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