AMD與HPE深化合作，共同推動開放式、可擴展AI基礎設施建設。合作以AMD專爲大規模AI工作負載設計的“Helios”全棧平臺爲基礎，HPE將成爲首批採用該架構的系統提供商之一。同時，HPE將結合與博通合作開發的Juniper網絡交換機，確保AI集羣間的高帶寬、低延遲連接，加速新一代AI基礎設施發展。
AMD與甲骨文達成重要合作，甲骨文計劃自2026年第三季度起在其數據中心部署多達5萬塊AMD最新Instinct MI450 AI芯片，採用新一代"Helios"機架設計。此舉將助力AMD在AI領域擴張，增強與英偉達的競爭力。
Helios9
基於DeBERTaV3的生物醫學命名實體識別模型，專門用於從臨床文本中提取疾病、藥物等結構化信息
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