高通發佈驍龍8 Elite Gen5旗艦芯片，將用於未來安卓旗艦設備。該芯片採用第三代Oryon CPU，主頻高達4.6GHz，顯著提升單核與多核性能，優化能效，帶來劃時代的運算體驗。
2024年10月22日，高通在驍龍技術峯會上發佈了全新旗艦移動平臺——驍龍8至尊版。這款芯片採用臺積電第二代3nm 工藝製造，搭載高通自研的 Oryon CPU 架構，實現了性能和能效的雙重提升。驍龍8至尊版是高通首款採用全大核設計的移動平臺，取消了此前大小核混合的設計思路。其 CPU 部分由兩個主頻高達4.32GHz 的超級核心和六個主頻爲3.53GHz 的性能核心組成，創下了手機處理器頻率的新紀錄。與上一代驍龍8Gen3相比，驍龍8至尊版的 CPU 性能提升最高可達50%，能效提升最高可達45%。GPU 方面，驍龍
["高通發佈驍龍X系列智能PC計算平臺，將帶來更高水平的性能、AI、連接和電池續航。","驍龍X系列平臺基於高通在CPU、GPU和NPU異構計算架構領域的多年經驗打造。","採用下一代定製高通Oryon CPU的驍龍X系列將實現性能和能效的顯著提升。","驍龍X系列所搭載的NPU將面向生成式AI新時代提供加速的終端側用戶體驗。","全新命名體系和視覺設計充分利用驍龍品牌目前在全球範圍內的品牌價值。"]
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