SK 海力士預計 AI 內存市場年增長 30% 至 2030 年
SK海力士高管預測，AI專用高帶寬內存(HBM)市場將以年增30%的速度持續增長至2030年。HBM通過垂直堆疊芯片技術提升能效，已成爲處理AI大數據的核心組件。公司正與三星、美光競逐下一代HBM4研發，該產品將集成定製化邏輯芯片以增強客戶黏性。儘管三星警告HBM3E可能出現供過於求，但云計算巨頭持續加碼AI投資仍將推動需求。當前NVIDIA等大客戶已獲得定製服務，未來中小客戶對差異化性能的需求也將增長。美國潛在半導體關稅政策暫未影響韓國廠商的在美生產計劃。（140字）
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