軟銀與英特爾攜手打造新型節能 AI 內存芯片，電力消耗或減半
近日，軟銀與英特爾聯合開發了一款全新的 AI 專用內存芯片，旨在大幅降低電力消耗，以便爲日本的 AI 基礎設施提供更爲高效的支持。根據日經亞洲的報道，雙方的合作目標是設計一種新型堆疊式 DRAM 芯片。這種芯片的佈線方式將不同於目前市場上流行的高帶寬內存（HBM），預期可以將電力消耗降低約50%。圖源備註:圖片由AI生成，圖片授權服務商Midjourney這項新技術的開發工作由一家新成立的公司 Saimemory 負責，該公司將專注於芯片的設計和專利管理，而實際的芯片製造則將外包給專業的
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