芯馳發佈新一代4納米 AI 座艙芯片 X10，提升智能駕駛體驗
在2025上海車展上，芯馳科技正式推出了最新研發的 AI 座艙芯片 ——X10。這款芯片採用了先進的4納米制程工藝，具備強大的計算能力，能夠支持7B 參數的多模態大模型在端側的本地部署。這標誌着芯馳科技在智能座艙芯片領域的一次重大突破，預計將大幅提升智能駕駛體驗。從技術規格來看，X10芯片配備了200K DMIPS 算力的 Arm v9.2架構 CPU，搭載1.8TFLOPS 算力的 GPU 以及40TOPS 算力的 NPU，確保其在處理複雜計算任務時具備極高的效率。該芯片還支持128bit 位寬的9600MT/s LPDDR5x 內存，系統內存帶寬達
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