小米發佈首款大模型專用AI加速芯片玄戒O100，採用6nm工藝與3D晶圓級堆疊方案，提升帶寬與集成度，標誌其在覈心算力芯片自研上邁出關鍵一步，顯示終端廠商AI硬件競爭進入深水區。
小米發佈首顆端側大模型AI加速芯片玄戒O100，採用6nm晶圓級垂直堆疊與混合鍵合工藝，鍵合間距1.4微米，帶寬達1.22TB/s，較傳統旗艦手機提升16倍，端側推理速度最高330TPS，顯著增強端側大模型吞吐與推理能力。
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