OpenAI已部署AMD Helios GPU机架，并合作开发下一代MI500系列AI芯片。该芯片预计2027年推出，采用台积电2nm制程、CDNA6架构与HBM4E内存，计划实现四年千倍性能跃升，内存带宽再创新高。
OpenAI为摆脱对英伟达依赖，正加速自研AI处理器，并与三星电子达成关键合作。三星将为其供应下一代高带宽内存HBM4芯片，用于OpenAI首款自研AI芯片。这标志着OpenAI从软件向硬件领域的重要跨越，其“星门项目”背后的算力野心进一步显现。
OpenAI首席战略官Jason Kwon表示，韩国具备AI创新理想条件，将与SK海力士和三星电子合作加速发展。他指出，这两家公司在存储市场的领先地位为AI计算提供强有力支撑，特别是SK海力士的高带宽存储器（HBM）技术在AI和数据中心中发挥关键作用。
英特尔近日首次曝光新一代AI芯片Jaguar Shores，目前正由热工程团队测试冷却方案。该芯片采用92.5mm×92.5mm封装，专为高性能计算平台设计，是英特尔首款机架级解决方案。采用18A先进工艺，配备HBM4内存，为多领域多IP产品。
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