深度求索发布DeepSeek V4.1 Flash，为全新结构系列最小模型，具备原生多模态视觉理解。新结构旨在提升能力上限、推理速度与吞吐，并可扩展至更大参数。该模型为552B参数MoE，采用Causal-Encoder-Decoder不对称结构：输入激活仅8B，输出激活16B，HBM需求降至1/4，显著降低成本。
三星电子2026年Q2财报：在AI热潮下存储芯片量价齐升，营收171.5万亿韩元（同比+130%），营业利润89.5万亿韩元（同比+1813.8%），双创新高。半导体贡献超99%利润，HBM成绝对引擎，已连续三季破纪录。
三星与博通达成长期深度合作，覆盖内存芯片、代工及先进封装全链条，预计到2030年合作规模突破2000亿美元，标志AI芯片进入“设计+制造”深度耦合阶段。技术核心是博通ASIC定制设计能力结合三星制造，双方将在2纳米以下制程与HBM高带宽内存领域联合攻坚。
OpenAI已部署AMD Helios GPU机架，并合作开发下一代MI500系列AI芯片。该芯片预计2027年推出，采用台积电2nm制程、CDNA6架构与HBM4E内存，计划实现四年千倍性能跃升，内存带宽再创新高。
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