AMD CEO苏姿丰预计下月亲赴韩国，与三星电子高层会谈，重点讨论AI芯片与技术合作，最受关注的是三星有望成为AMD的HBM4供应商。双方今年3月已签署AI存储芯片与计算技术合作谅解备忘录，当时便有传闻称三星被AMD选为AI芯片合作方，此次会谈或推动合作落地。
韩国AI芯片创企FuriosaAI公布第三代AI推理加速器：与博通合作，含2颗2nm计算裸晶、1颗I/O裸晶、12个48GB HBM4(E)堆栈，支持PCIe Gen7，机架内SUE全连接。尺寸为二代8倍，算力32 PFLOPS为二代32倍。
OpenAI已部署AMD Helios GPU机架，并合作开发下一代MI500系列AI芯片。该芯片预计2027年推出，采用台积电2nm制程、CDNA6架构与HBM4E内存，计划实现四年千倍性能跃升，内存带宽再创新高。
OpenAI为摆脱对英伟达依赖，正加速自研AI处理器，并与三星电子达成关键合作。三星将为其供应下一代高带宽内存HBM4芯片，用于OpenAI首款自研AI芯片。这标志着OpenAI从软件向硬件领域的重要跨越，其“星门项目”背后的算力野心进一步显现。
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