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AMD与甲骨文达成重要合作，甲骨文计划自2026年第三季度起在其数据中心部署多达5万块AMD最新Instinct MI450 AI芯片，采用新一代"Helios"机架设计。此举将助力AMD在AI领域扩张，增强与英伟达的竞争力。
Helios9
基于DeBERTaV3的生物医学命名实体识别模型，专门用于从临床文本中提取疾病、药物等结构化信息
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