芯驰发布新一代4纳米 AI 座舱芯片 X10，提升智能驾驶体验
在2025上海车展上，芯驰科技正式推出了最新研发的 AI 座舱芯片 ——X10。这款芯片采用了先进的4纳米制程工艺，具备强大的计算能力，能够支持7B 参数的多模态大模型在端侧的本地部署。这标志着芯驰科技在智能座舱芯片领域的一次重大突破，预计将大幅提升智能驾驶体验。从技术规格来看，X10芯片配备了200K DMIPS 算力的 Arm v9.2架构 CPU，搭载1.8TFLOPS 算力的 GPU 以及40TOPS 算力的 NPU，确保其在处理复杂计算任务时具备极高的效率。该芯片还支持128bit 位宽的9600MT/s LPDDR5x 内存，系统内存带宽达
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