小米发布首款大模型专用AI加速芯片玄戒O100，采用6nm工艺与3D晶圆级堆叠方案，提升带宽与集成度，标志其在核心算力芯片自研上迈出关键一步，显示终端厂商AI硬件竞争进入深水区。
小米发布首颗端侧大模型AI加速芯片玄戒O100，采用6nm晶圆级垂直堆叠与混合键合工艺，键合间距1.4微米，带宽达1.22TB/s，较传统旗舰手机提升16倍，端侧推理速度最高330TPS，显著增强端侧大模型吞吐与推理能力。
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