At the grand 2025 World Conference held today, the company's Executive Vice President Shen Dou announced two important products, the new generation Kunlun chips M100 and M300, as well as two high-performance super nodes, Baidu Tianchi 256 and 512. It is reported that these new products will soon be launched in the market.
Core Product Launches and Future Strategy
Shen Dou also revealed the five-year product strategy plan for the Kunlun chip at the event. According to this plan, the company will maintain a pace of launching one or more new products each year, continuously strengthening its high-performance computing cloud infrastructure to help enterprise customers better internalize and apply computing capabilities.
An impressive goal is that by 2030, Baidu plans to achieve a deployment scale of one million Kunlun chips in a single cluster, demonstrating its ambition for the future development of computing power.
Current Progress and Market Position
So far, the Kunlun chip has completed the deployment of tens of thousands of units and has become a key foundation in the company's computing technology stack. Baidu Intelligent Cloud, with the Kunlun chip and the Baige computing platform, has already provided a large number of enterprises with high-performance and highly scalable computing support.
Thanks to its layout in the full range of computing cloud services, Baidu Intelligent Cloud has maintained the leading position of first in the Chinese computing cloud service market for six consecutive years.
