The Fourth China International Supply Chain Promotion Expo was officially launched in Beijing. At the launch of the Chain Expo, Intel, in collaboration with several leading domestic technology companies, officially released the "AI Family Brain" solution, aiming to jointly build a new intelligent AI family ecosystem. This move marks an important breakthrough in the application of edge-side AI in the smart home field.
According to the information, this solution is built on the third-generation Intel® Core™ Ultra and Core™ processors. The core highlight is the support for efficiently running the "AI brain" locally. Compared to traditional smart home solutions that rely on the cloud, local computing power can not only significantly enhance privacy security and response speed, but also deeply integrate all home devices. In practical applications, the solution comprehensively covers five scenarios: health, safety, entertainment, emotional interaction, and daily life, achieving a transition from single device control to full-scene proactive services.
This conference attracted deep participation from mainstream domestic technology forces. Haier, Hisense, Lenovo, Tencent, Midea, TCL, JD.com, MindSpore Intelligence, Xiaomi, Honor, Tuya Smart, MiniMax, and other industry giants attended to support this ecosystem. Currently, large model technology is accelerating its penetration towards the edge and device ends. Intel's collaboration with upstream and downstream enterprises in chip computing power, terminal hardware, and large model algorithms demonstrates a comprehensive cooperation model for edge-side AI deployment. This kind of ecosystem collaboration led by computing power giants is expected to further break down ecological barriers between brands and accelerate the smart home industry's evolution toward a true edge-side intelligent era.
